Electroplating apparatus with segmented anode array

Details Electroplating apparatus with segmented anode array Electroplating apparatus with segmented anode array

2008-04-15

2008-04-15

King, Roy (Department: 1793)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C204S229800, C204S232000, C204S242000, C204S275100, C204S286100, C205S123000, C205S291000, C205S292000

Reexamination Certificate

active

07357850

ABSTRACT:
An electroplating apparatus includes a reactor vessel having a segmented anode array positioned therein for effecting electroplating of an associated workpiece such as a semiconductor wafer. The anode array includes a plurality of ring-like anode segments which are preferably positioned in concentric, coplanar relationship with each other. The anode segments can be independently operated to create varying electrical potentials with the associated workpiece to promote uniform deposition of electroplated metal on the surface of the workpiece.

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