Modular interconnect structure

Details Modular interconnect structure Modular interconnect structure

2011-08-02

2011-08-02

Chriss, Andrew (Department: 2472)

Multiplex communications

Pathfinding or routing

Switching a message which includes an address header

C370S386000, C710S104000, C379S291000

Reexamination Certificate

active

07990983

ABSTRACT:
Some embodiments of the invention include an interconnect structure to transfer data among a plurality of devices. The interconnect structure includes a crossbar and a number of interconnect branches coupled to the crossbar. Each of the interconnect branches includes a number of connector circuits coupled in series to transfer data in a group of devices of the plurality of devices. The crossbar includes a number of connector circuits coupled in series to allow one group of devices from one interconnect branch to exchange data with another group of devices from another interconnect branch. Other embodiments are described and claimed.

REFERENCES:
patent: 4866606 (1989-09-01), Kopetz
patent: 5175824 (1992-12-01), Soderbery et al.
patent: 5930256 (1999-07-01), Greene et al.
patent: 6208667 (2001-03-01), Caldara et al.
patent: 6477659 (2002-11-01), Ho
patent: 6621818 (2003-09-01), Szczepanek et al.
patent: 6963989 (2005-11-01), Cullum et al.
patent: 7079485 (2006-07-01), Lau et al.
patent: 7110394 (2006-09-01), Chamdani et al.
patent: 7197032 (2007-03-01), Gammenthaler et al.
patent: 7426632 (2008-09-01), Denham
patent: 2003/0040898 (2003-02-01), McWilliams et al.
patent: 2003/0043797 (2003-03-01), Rashid et al.
patent: 2003/0221043 (2003-11-01), Sota
patent: 2004/0114588 (2004-06-01), Bhaskaran
patent: 2004/0151209 (2004-08-01), Cummings et al.
patent: 2005/0163114 (2005-07-01), Konig et al.
patent: 2006/0224912 (2006-10-01), Denham
“U.S. Appl. No. 10/095,289, Non-Final Office Action mailed Oct. 9, 2007”, 21 pages.
Chinese Application No. 200610084167.6 Office Action mailed Dec. 21, 2007, 40 pgs.
“U.S. Appl. No. 11/095,289 Notice of Allowance mailed May 2, 2008.”, NOAR, 10 pgs.
200610084167.6, “Application Serial No. 200610084167.6 Office Action Mailed Nov. 11, 2008”, 25.

Affiliated with

Also associated with

Rating

Modular interconnect structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Modular interconnect structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Modular interconnect structure will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2791203