Electronic device and method of manufacturing the same

Details Electronic device and method of manufacturing the same Electronic device and method of manufacturing the same

2008-01-29

2008-01-29

Le, Thien M. (Department: 2876)

Registers

Records

Conductive

C235S487000

Reexamination Certificate

active

07322531

ABSTRACT:
A memory card wherein a substrate is affixed to a cap is formed without the projection of substrate edges from a back surface of the cap. The memory card includes a substrate having a sealing member bonded to a recess in the cap. By utilizing a difference in thermal expansion coefficient between the sealing member and the substrate, the substrate is warped so that its central portion projects away from the cap. The shallow recess is deeper than the sum of the thickness of the substrate and the thickness of an adhesive for bonding the substrate to the bottom of the shallow recess, whereby peripheral edges of the substrate retract into the shallow recess without projecting from the back surface of the cap. The cap is shaped as a card several millimeters thick. A memory chip and control chip are incorporated in the sealing member.

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