Post passivation interconnection process and structures

Details Post passivation interconnection process and structures Post passivation interconnection process and structures

2008-04-08

2008-04-08

Wojciechowicz, Edward (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S359000, C257S536000, C257S537000

Reexamination Certificate

active

07355282

ABSTRACT:
A system and method for forming post passivation metal structures is described. Metal interconnections and high quality electrical components, such as inductors, transformers, capacitors, or resistors are formed on a layer of passivation, or on a thick layer of polymer over a passivation layer.

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