Semiconductor device having a ferroelectric capacitor

Semiconductor device manufacturing: process – Having magnetic or ferroelectric component

Reexamination Certificate

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Details

C438S238000, C438S239000, C438S126000, C438S128000

Reexamination Certificate

active

07915054

ABSTRACT:
An ultra-thin semiconductor chip of an FeRAM, which is miniaturized and highly integrated with characteristic degradation of a ferroelectric capacitor suppressed though a thin package structure is applied to the FeRAM is realized. The semiconductor chip is molded up by using a sealing resin with a filler content set at a value in a range of 90 weight % to 93 weight % to produce a package structure.

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Chinese Office Action dated Nov. 9, 2007, issued in corresponding Chinese patent application No. 200610066109.0.
Japanese Office Action dated Apr. 28, 2009, issued in corresponding Japanese Patent Application No. 2005-209093.

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