Method of manufacturing a semiconductor device

Semiconductor device manufacturing: process – Having magnetic or ferroelectric component

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257SE21664

Reexamination Certificate

active

07371588

ABSTRACT:
A method of manufacturing a semiconductor device includes: forming a circuit element on a semiconductor substrate; forming a first insulation film on top to cover the circuit element; forming a first electrode on top; forming a ferroelectric film on the first electrode; forming a second electrode on the ferroelectric film; forming a mask film on the second electrode; etching the second electrode with the semiconductor substrate or a mounting electrode set to a first temperature using the mask film as a mask; etching the ferroelectric film with the semiconductor substrate or the mounting electrode set to a second temperature using the mask film as a mask, the second temperature being lower than the first temperature; and etching the first electrode with the semiconductor substrate or the mounting electrode set to a third temperature using the mask film as a mask, the third and first temperatures being approximately the same.

REFERENCES:
patent: 5776356 (1998-07-01), Yokoyama et al.
patent: 5792672 (1998-08-01), Chan et al.
patent: 6316797 (2001-11-01), Van Buskirk et al.
patent: 6436838 (2002-08-01), Ying et al.
patent: 6541380 (2003-04-01), Ying et al.
patent: 6682944 (2004-01-01), Kikuchi et al.
patent: 6746878 (2004-06-01), Komuro et al.
patent: 2002/0076936 (2002-06-01), Iguchi
patent: 2002/0117701 (2002-08-01), Sun et al.
patent: 2002/0119669 (2002-08-01), Ono et al.
patent: 2003/0119211 (2003-06-01), Summerfelt et al.
patent: 2003/0166326 (2003-09-01), Kikuchi et al.
patent: 2003/0227046 (2003-12-01), Ando et al.
patent: 2003/0235944 (2003-12-01), Okita
patent: 2004/0129670 (2004-07-01), Kweon et al.
patent: 2004/0157459 (2004-08-01), Ying et al.
patent: 2004/0196618 (2004-10-01), Komuro et al.
patent: 2006/0071258 (2006-04-01), Tomioka et al.
patent: 09-251983 (1997-09-01), None
patent: 09-266200 (1997-10-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of manufacturing a semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing a semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a semiconductor device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2779960

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.