Signal transmission structure and circuit substrate thereof

Details Signal transmission structure and circuit substrate thereof Signal transmission structure and circuit substrate thereof

2008-05-27

2008-05-27

Dinh, Tuan (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S260000, C174S264000, C174S265000, C174S266000, C361S777000, C361S792000, C361S795000

Reexamination Certificate

active

07378601

ABSTRACT:
A signal transmission structure is provided. The structure mainly comprises at least a conductive via, at least a via land and a conductive wall. One end of the conductive via is connected to the via land. The conductive wall covers only a portion of the inner wall of a through hole in the core layer of a circuit substrate. The conductive wall has a semi-circular or a C-shaped structure. Therefore, when a signal passes the conductive via and the via land of the circuit substrate through the conductive wall in the interior of the via, because of a more continuous impedance between the via land and the conductive wall, signal reflection due to impedance mismatch along the signal transmission pathway can be reduced to enhance signal transmission quality.

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