Process for forming dicing lines on wafer

Details Process for forming dicing lines on wafer Process for forming dicing lines on wafer

1989-04-05

1990-10-30

Hix, L. T.

Photocopying

Projection printing and copying cameras

Step and repeat

355 77, 437226, G03B 2742

Patent

active

049672290

ABSTRACT:
A process for forming dicing lines on a wafer which comprises: exposing a wafer region in which a dicing line pattern has not been formed to light irradiated through and patterned by a reticle for forming dicing lines; the reticle having a nonpatterned region of the same size as a device pattern region of a reticle for forming a device pattern on the wafer and a dicing zone which is in contact with the periphery of the nonpatterned region.

REFERENCES:
patent: 4542397 (1985-09-01), Biegelsen et al.

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