Thermal mass compensated dielectric foam support structures...

Electricity: conductors and insulators – With fluids or vacuum – Conduits – cables and conductors

Reexamination Certificate

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C174S1020SP

Reexamination Certificate

active

07902456

ABSTRACT:
Thermal mass compensated foam support structures for coaxial cables such as inner conductors and or inner conductor support structures. The foam support structures provided with an adhesive solid or high density foam polymer or blend layer to increase the thermal mass of the support structure enough to allow the foam to surround the adhesive solid or high density foam polymer or blend layer without forming unacceptably large voids in the foam dielectric as the foam dielectric cures.

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patent: 2004/0151446 (2004-08-01), Wyatt et al.
patent: 2004/0222009 (2004-11-01), Blew et al.

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