Method of manufacturing self-supporting contacting structures

Details Method of manufacturing self-supporting contacting structures Method of manufacturing self-supporting contacting structures

2008-05-06

2008-05-06

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257SE23023

Reexamination Certificate

active

07368324

ABSTRACT:
A self-supporting contacting structure is directly produced on a component that does not have a housing by applying a layer made of non conducting material and a layer made of an electrically conductive material to the component and to a support and by subsequently removing these layers from said support.

REFERENCES:
patent: 5291066 (1994-03-01), Neugebauer et al.
patent: 5353498 (1994-10-01), Fillion et al.
patent: 5637922 (1997-06-01), Fillion et al.
patent: 5653019 (1997-08-01), Bernhardt et al.
patent: 6127199 (2000-10-01), Inoue et al.
patent: 6519840 (2003-02-01), Stalder
patent: 7208347 (2007-04-01), Seliger et al.
patent: 2002/0039464 (2002-04-01), Yoshimura et al.
patent: 2003/0015774 (2003-01-01), Auburger et al.
patent: 2006/0252253 (2006-11-01), Seliger et al.
patent: 91 09 295 (1991-11-01), None
patent: 100 04 410 (2001-08-01), None
patent: WO 95/09438 (1995-04-01), None
Paavo Jalonen, “A new concept® for making fine line substrate for active component in polymer”, Microelectronics Journal, Feb. 2003, pp. 99-107, vol. 34, No. 2, Mackintosh Publications Ltd., Luton, Germany.

Affiliated with

Also associated with

Rating

Method of manufacturing self-supporting contacting structures does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing self-supporting contacting structures, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing self-supporting contacting structures will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2775236