Method of forming molded standoff structures on integrated...

Details Method of forming molded standoff structures on integrated... Method of forming molded standoff structures on integrated...

2011-08-09

2011-08-09

Roman, Angel (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Having light transmissive window

C438S064000, C438S068000, C438S106000, C438S113000, C257SE21001, C257SE21505

Reexamination Certificate

active

07993977

ABSTRACT:
A method of forming molding standoff structures on integrated circuit devices is disclosed which includes forming a plurality of standoff structures on a substantially rectangular sheet of transparent material and, after forming the standoff structures, singulating the substantially rectangular sheet of transparent material into a plurality of individual transparent members, each of which comprise at least one of the plurality of standoff structures.

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