Semiconductor device and semiconductor package

Details Semiconductor device and semiconductor package Semiconductor device and semiconductor package

2008-07-15

2008-07-15

Pert, Evan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

C257S774000, C257S502000, C257S503000

Reexamination Certificate

active

07400039

ABSTRACT:
For delivering supply power evenly into chip, a semiconductor device includes plural power supply pads17aand grounding pads18a, arranged in alternation in X-direction. The device also includes first upper layer power supply wire17b, extending in X-direction and connected to first ends of the power supply pads17, a first upper layer grounding wire18b, extending in X-direction and connected to second end, opposing first end, of the grounding pads18ain X-direction. A second upper layer power supply wire17cextending between first upper layer power supply wire17band first upper layer grounding wire18b, from the power supply pad17anearly to neighboring grounding pad18a, and second upper layer grounding wire18cextending between first upper layer power supply wire17band first upper layer grounding wire18b, from the grounding pad18anearly to neighboring power supply pad17a. The pads or wires17a, 17b, 17c, 18a, 18band18care formed on the same pad layer.

REFERENCES:
patent: 2001-203271 (2001-07-01), None

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