Solder metal, soldering flux and solder paste

Metal fusion bonding – Solder form

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C228S245000, C148S022000, C148S024000

Reexamination Certificate

active

07357291

ABSTRACT:
Solder metal consists essentially of 8.8 to 5.0 mass % of Zn, 0.05 to 0 mass % of Bi and the balance of Sn and unavoidable impurities.

REFERENCES:
patent: 2875514 (1959-03-01), Doerr
patent: 4533404 (1985-08-01), Hasegawa
patent: 4670217 (1987-06-01), Henson et al.
patent: 4684054 (1987-08-01), Iwasa et al.
patent: 4906307 (1990-03-01), Fujiyoshi
patent: 5234508 (1993-08-01), Kobayashi et al.
patent: 5538686 (1996-07-01), Chen et al.
patent: 5718868 (1998-02-01), Junichi et al.
patent: 5904782 (1999-05-01), Diep-Quang
patent: 5918796 (1999-07-01), Matsuda et al.
patent: 5938856 (1999-08-01), Sachdev et al.
patent: 6184475 (2001-02-01), Kitajima et al.
patent: 6241942 (2001-06-01), Murata et al.
patent: 6334905 (2002-01-01), Hanawa et al.
patent: 6476487 (2002-11-01), Kuramoto et al.
patent: 6881278 (2005-04-01), Amita et al.
patent: 6896172 (2005-05-01), Taguchi et al.
patent: 2001/0025874 (2001-10-01), Nishiyama
patent: 2001/0042779 (2001-11-01), Amita et al.
patent: 2002/0046627 (2002-04-01), Amita et al.
patent: 2002/0102432 (2002-08-01), Ochiai et al.
patent: 2003/0015574 (2003-01-01), Teshima et al.
patent: 2003/0059642 (2003-03-01), Mei
patent: 2003/0143419 (2003-07-01), Nakamura
patent: 1286655 (2001-03-01), None
patent: 101 14 191 (2001-10-01), None
patent: 1 099 507 (2001-05-01), None
patent: 3-106594 (1991-05-01), None
patent: 03 155493 (1991-07-01), None
patent: 4-59079 (1992-09-01), None
patent: 06 226488 (1994-08-01), None
patent: 7-7244 (1995-01-01), None
patent: 2002-361476 (2002-12-01), None
patent: 8-155676 (2005-06-01), None
patent: 56-32079 (2005-07-01), None
patent: 500948 (1976-11-01), None
Patent Abstract of Japan vol. 018, No. 598 (M-1704), Nov. 15, 1994, abstracting JP 06-226488A.
Patent Abstract of Japan vol. 015, No. 381 (M-1162), Sep. 26, 1991, abstracting JP 03-155493A.
Patent Abstract of Japan vol. 2003, No. 04, Apr. 2, 2003, abstracting JP 2002-361476A.
Power Industry Handbook: 1.1.4.7 Electrical Detection Method (Coulter Counter Method).
German, “Powder Metallurgy Science,” translated by Hideshi Miura and Ken-ichi Takagi, published by Uchida Rokakaho Publishing Co., Ltd., pp. 102-110 (1996).
“The ECOnomics of Environmental Compliance”, by SMT (Special Series) (Surface Mount Technology Magazine) (NEPCON West '97 Buyers'Guide), published on Feb. 1997, pp. 66 and 68.
“Standard Microsoldering Technique,” pp. 67-68, edited by Microsoldering Technique Qualification/Test Committe, The Japan Welding Engineering Society, published by The Nikkan Kogyo Shimbun, Ltd.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Solder metal, soldering flux and solder paste does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Solder metal, soldering flux and solder paste, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Solder metal, soldering flux and solder paste will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2772932

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.