Low crosstalk substrate for mixed-signal integrated circuits

Details Low crosstalk substrate for mixed-signal integrated circuits Low crosstalk substrate for mixed-signal integrated circuits

Filed on

2008-07-22

Date issued

2008-07-22

Examiner

Ho, Tu-Tu V (Department: 2818)

Patent Class

Active solid-state devices (e.g., transistors, solid-state diode

SubClass

Integrated circuit structure with electrically isolated...

Other Related Categories

C257SE25029, C257S500000, C257S659000, C257SE25031

Type

Reexamination Certificate

Status

active

Patent number

07402884

Description

ABSTRACT:
An integrated circuit laminate with a metal substrate for use with high performance mixed signal integrated circuit applications. The metal substrate provides substantially improved crosstalk isolation, enhanced heat sinking and an easy access to a true low impedance ground. In one embodiment, the metal layer has regions with insulation filled channels or voids and a layer of insulator such as unoxidized porous silicon disposed between the metal substrate and a silicon integrated circuit layer. The laminate also has a plurality of metal walls or trenches mounted to the metal substrate and transacting the silicon and insulation layers thereby isolating noise sensitive elements from noise producing elements on the chip. In another embodiment, the laminate is mounted to a flexible base to limit the flexion of the chip.

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