Method of welding sputtering target/backing plate assemblies

Details Method of welding sputtering target/backing plate assemblies Method of welding sputtering target/backing plate assemblies

1993-05-18

1994-08-30

Weisstuch, Aaron

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20429813, 2281145, C23C 1434

Patent

active

053424964

ABSTRACT:
Methods of preparing a sputter target or a sputter target/backing plate assembly and assemblies so prepared are disclosed. The methods comprise forming a friction weld joint consisting of a horizontal surface, an angled surface, a curved surface or any combination of the preceding. The target is rotated in the collet of a friction welding machine and the base or backing plate forced against the target to form the weld.

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