Method for assembling micro structures

Details Method for assembling micro structures Method for assembling micro structures

2008-04-08

2008-04-08

Nguyen, Donghai D. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S834000, C029S836000, C029S900000, C257S215000, C385S018000

Reexamination Certificate

active

07353593

ABSTRACT:
A method for making three-dimensional structures comprises providing a plurality of components, each of which is moveably coupled to a substrate. The components may be pivotally coupled to the substrate by one or more micromachined hinges. The components are moved using electrostatic forces which lift the components from the surface of the substrate. The components may then be moved further by providing electrostatic forces between components. Two or more components may engage with one another to provide a three-dimensional structure.

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K. S. J. Pister, M. W. Judy, S. R. Burgett and R. S. Fearing—“Microfabricated Hinges”,Sensors and Actuators A.vol. 33, No. 3, pp. 249-256, 1992.
M. C. Wu, L. Y. Lin and S. S. Lee—“Micromachined Free-Space Integrated Optics”,Proc. SPIEvol. 2291, Integrated Optics and Microstructures II, San Diego, CA, Jul. 28, 1994.

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