Method for manufacturing electronic components

Details Method for manufacturing electronic components Method for manufacturing electronic components

2011-03-15

2011-03-15

Nguyen, Donghai D. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S413000, C029S831000, C029S851000, C156S150000, C156S236000, C257S620000, C438S114000, C438S464000

Reexamination Certificate

active

07905012

ABSTRACT:
A method for manufacturing an electronic component includes: a step of temporarily bonding a substrate to a support plate with an adhesive sheet; a step of forming a cut groove for dividing the substrate into individual chips by providing the substrate with a cut extending in the thickness direction from a second surface side, located opposite the first surface side, to a certain part of the support plate; a step of forming a continuous electrode on the second surface and on a peripheral surface located inside the cut groove, of each of the chips by sputtering, for example; and a step of detaching the chips from the support plate. An electrode on the first surface of the substrate may be formed prior to the temporary bonding step, and the electrode formed on the peripheral surface may be connected to the electrode on the first surface.

REFERENCES:
patent: 3324014 (1967-06-01), Modjeska
patent: 6562647 (2003-05-01), Zandman et al.
patent: 7208335 (2007-04-01), Boon et al.
patent: 7-254534 (1995-10-01), None
patent: 8-236307 (1996-09-01), None
patent: 2001-237268 (2001-08-01), None
patent: 2004-289085 (2004-10-01), None
patent: 2004-296675 (2004-10-01), None
patent: 3613091 (2004-11-01), None
patent: 2005-268302 (2005-09-01), None
patent: 2006-80496 (2006-03-01), None
Chinese Office Action (with English translation) issued on Dec. 17, 2010, in Chinese Patent Appln. No. 2008100869064 (15 pages).

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