Semiconductor package, method of production of same, and...

Details Semiconductor package, method of production of same, and... Semiconductor package, method of production of same, and...

2008-01-01

2008-01-01

Pert, Evan (Department: 2826)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S106000, C438S107000, C438S329000, C438S584000, C438S800000, C257S700000, C257S758000, C361S763000

Reexamination Certificate

active

07314780

ABSTRACT:
A semiconductor package, provided with a multilayer interconnect structure, for mounting a semiconductor chip on its top surface, wherein a topmost stacked structure of the multilayer interconnect structure includes a capacitor structure, the capacitor structure having a dielectric layer comprised of a mixed electrodeposited layer of high dielectric constant inorganic filler and insulating resin and including chip connection pads for directly connecting top electrodes and bottom electrodes with electrodes of the semiconductor chip, whereby greater freedom in design of interconnect patterns can be secured, the degree of proximity of the capacitor and semiconductor chip can be greatly improved, and the package can be made smaller and lighter in weight, a method of production of the same, and a semiconductor device using this semiconductor package.

REFERENCES:
patent: 5796587 (1998-08-01), Lauffer et al.
patent: 6392898 (2002-05-01), Asai et al.
patent: 6480370 (2002-11-01), Koning et al.
patent: 6487088 (2002-11-01), Asai et al.
patent: 6545353 (2003-04-01), Mashino
patent: 6611419 (2003-08-01), Chakravorty
patent: 6764931 (2004-07-01), Iijima et al.
patent: 6828224 (2004-12-01), Iijima et al.
patent: 6939738 (2005-09-01), Nakatani et al.
patent: 6952049 (2005-10-01), Ogawa et al.
patent: 7239014 (2007-07-01), Ogawa et al.
patent: 11-260148 (1999-09-01), None
patent: 2000-208945 (2000-07-01), None
patent: 2001-223301 (2001-08-01), None
patent: 2001-267751 (2001-09-01), None
Japanese Office Action for corresponding Japanese Patent Application No. JP2003-058792 dated May 31, 2007.

Affiliated with

Also associated with

Rating

Semiconductor package, method of production of same, and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor package, method of production of same, and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor package, method of production of same, and... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2764025