Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2008-04-29
2008-04-29
Baumeister, B. William (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S057000, C438S052000, C438S056000, C257SE21261, C257SE21002
Reexamination Certificate
active
07364942
ABSTRACT:
This invention discloses a process for forming durable anti-stiction surfaces on micromachined structures while they are still in wafer form (i.e., before they are separated into discrete devices for assembly into packages). This process involves the vapor deposition of a material to create a low stiction surface. It also discloses chemicals which are effective in imparting an anti-stiction property to the chip. These include polyphenylsiloxanes, silanol terminated phenylsiloxanes and similar materials.
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Analog Devices Inc.
Anya Igwe U.
Baumeister B. William
Weingarten Schurgin, Gagnebin & Lebovici LLP
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