Multilayer integrated circuit module

Details Multilayer integrated circuit module Multilayer integrated circuit module

1990-08-20

1992-03-03

Wojciechowicz, Edward J.

Fishing, trapping, and vermin destroying

357 55, 357 71, 437 66, 437183, 437203, 437209, H01L 2348, H01L 21302

Patent

active

050937081

ABSTRACT:
A multilayer integrated circuit module for supporting integrated circuit chips and for interfacing the chips to external circuitry is disclosed. Each integrated circuit is formed to have conductive contact pads disposed upon beveled edges. The module is comprised of a base layer and a plurality of stacked layers having apertures formed therein and disposed upon the base layer such that at least one well is formed. The aperture defining inclined sidewalls with conductive conduits formed thereon. The inclined sidewalls are formed to support the integrated circuit chips upon the beveled surfaces thereof. The conductive conduits formed on the incline sidewalls contact the integrated circuit chip conductive contact pads. The base layer has conductive conduits formed thereon, the base layer further has vertically inclined surfaces spaced to receive and support the integrated circuit chips along beveled edge portions thereof. The base layer conductive conduits extend along the vertically inclined surfaces and contact the integrated circuit conductive contact pads. Thus, the integrated circuit chips are supported within the wells and are connected to the conductive conduits formed on the base layer and stacked layers solely by means of abutting electrical connection with the chip beveled edge portions. A pattern of conductive conduits formed upon the plurality of stacked layers interfaces the integrated circuit chip to external circuitry. Each of the stacked layers may have a pattern of conductive conduits formed thereon.

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