Multilayer wiring substrate for providing a capacitor...

Details Multilayer wiring substrate for providing a capacitor... Multilayer wiring substrate for providing a capacitor...

2008-04-01

2008-04-01

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257SE23062, C257S023000, C257SE23097, C257S701000, C257S528000, C257S532000, C257S288000, C257S296000, C257S773000, C257S774000, C257SE27104, C257SE27081, C257SE27112, C257SE27048, C257S698000, C257S778000, C361S306100, C361S311000, C361S782000, C174S050510, C174S260000, C174S565000

Reexamination Certificate

active

07352060

ABSTRACT:
A multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring structure is disclosed. The multilayer wiring substrate includes a dielectric layer including a resin material mixed with an inorganic filler, wherein the inorganic filler is fabricated by mixing a paraelectric filler with an inorganic filler having a high dielectric constant.

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