Porous-film-forming composition, preparation method of the...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...

Reexamination Certificate

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C524S284000, C528S021000, C528S034000

Reexamination Certificate

active

07402621

ABSTRACT:
The invention provides a coating solution for forming a porous film having excellent mechanical strength and dielectric properties and for easily forming a film with a freely controlled film thickness in an ordinarily employed method in semiconductor process. More specifically, provided are a method for preparing a porous-film-forming composition comprising steps of preparing polysiloxane, silica or zeolite particles (Component A), imparting crosslinkability to Component A, and temporarily terminating the crosslinkability; and a porous-film-forming composition obtainable in this method. In addition, provided is a method of forming a porous film comprising steps of preparing a porous-film-forming composition by preparing Component A, imparting crosslinkability to Component A and adding a crosslinkability inhibitor to temporarily terminate the crosslinkability; applying the porous-film-forming composition onto a substrate to form a film, drying the film, crosslinking the particles along with removing the crosslinkability inhibitor by heating the dried film.

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European Search Report corresponding to application No. EP 05250339.8, dated May 23, 2005.
Stober et al. “Controlled Growth of Monodisperse Silica Spheres in the Micron Size Range”,Journal of Colloid and Interface Science26:62-69 (1968).
Huang et al. “Fabrication of Ordered Porous Structures by Self-Assembly of Zeolite Nanocrystals”,J. Am. Chem. Soc. 122:3530-3531 (2000).

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