Semiconductor mounting system and semiconductor chip

Details Semiconductor mounting system and semiconductor chip Semiconductor mounting system and semiconductor chip

1998-07-24

2000-12-19

Gaffin, Jeffrey

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361744, 361686, 257686, 257777, 174255, 174260, H05K 114

Patent

active

06163459&

ABSTRACT:
A semiconductor mounting system of the present invention includes a first semiconductor chip in which a first semiconductor integrated circuit is packaged and a second semiconductor chip in which a second semiconductor integrated circuit is packaged. The first semiconductor chip includes a plurality of first pins provided on a first surface and a plurality of second pins provided on a second surface. The second semiconductor chip includes a plurality of third pins provided on a third surface and a plurality of fourth pins provided on a fourth surface. The semiconductor mounting system further includes: a plurality of first lines for electrically connecting the first pins with the third pins; and a plurality of second lines for electrically connecting the second pins with the fourth pins. A length of the first lines is substantially equal to a length of the second lines.

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Partial Translation of Office Action issued in Japanese Patent Application No. 10-210001; Office Action received by Japanese Associate on Feb. 25, 1999.

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