Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-07-22
2008-07-22
Thompson, Gregory D (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S694000
Reexamination Certificate
active
07403388
ABSTRACT:
A cooling system in accordance with a preferred embodiment of the invention includes a chassis, a fan mounted in the chassis, a memory, and an air conducting cover, wherein the air conducting cover comprises two sidewalls mounted in the chassis, and a top wall connecting tops of the two sidewalls, the two sidewalls and the top wall cooperatively form an airflow channel, and the memory is in the airflow channel. Because the airflow channel is narrow, a more efficient airflow speed is achieved in the airflow channel. Thus, the cooling system effectively dissipates heat without encroaching on much needed space.
REFERENCES:
patent: 5734551 (1998-03-01), Hileman et al.
patent: 6130819 (2000-10-01), Lofland et al.
patent: 6292361 (2001-09-01), Johnson et al.
patent: 6330154 (2001-12-01), Fryers et al.
patent: 6442024 (2002-08-01), Shih
patent: 6504718 (2003-01-01), Wu
patent: 7061760 (2006-06-01), Hornung et al.
patent: 7061761 (2006-06-01), Tucker et al.
patent: 7215543 (2007-05-01), Arbogast et al.
patent: 1414442 (2003-04-01), None
patent: 2653580 (2004-11-01), None
patent: 1852645 (2006-10-01), None
Chung Wei Te
Hon Hai Precision Industry Co. Ltd.
Thompson Gregory D
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