Ball grid array assignment

Details Ball grid array assignment Ball grid array assignment

2008-07-29

2008-07-29

Dinh, Tuan T. (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S782000, C361S792000, C174S261000

Reexamination Certificate

active

07405946

ABSTRACT:
A pattern of contacts that includes high speed transmitter contacts disposed in a first portion of the pattern, where the high speed transmitter contacts are disposed in first ordered channels of adjacent transmitter differential pairs. High speed receiver contacts are disposed in a second portion of the pattern, where the first portion of the pattern is not interspersed with the second portion of the pattern, and the high speed receiver contacts are disposed in first ordered channels of adjacent receiver differential pairs. At least one unbroken line of other contacts is disposed between the first portion of the pattern and the second portion of the pattern, where the other contacts do not contain any high speed transmitter contacts and high speed receiver contacts. Low speed IO contacts are disposed in a third portion of the pattern. The first ordered channels are ordered to match an order of transmitter channels of a connector or another component on a printed circuit board to which the transmitter differential pairs are routed, and the second ordered channels are ordered to match an order of receiver channels of a connector or another component on a printed circuit board to which the receiver differential pairs are routed.

REFERENCES:
patent: 7069646 (2006-07-01), Duxbury et al.
patent: 7095107 (2006-08-01), Ramakrishnan et al.
patent: 7105926 (2006-09-01), Ramakrishnan et al.
patent: 2007/0001270 (2007-01-01), Sukegawa et al.

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