System for field assisted statistical assembly of wafers

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Magnetic field

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

07323757

ABSTRACT:
A wafer having heterostructure therein is formed using a substrate with recesses formed within a dielectric layer. A magnetized magnetic layer or a polarized electret material is formed at the bottom of each recess. The magnetized magnetic layer or a polarized electret material provides a predetermined magnetic or electrical field pattern. A plurality of heterostructures is formed from on an epitaxial wafer wherein each heterostructure has formed thereon a non-magnetized magnetic layer that is attracted to the magnetized magnetic layer formed at the bottom of each recess or dielectric layer that is attracted to the polarized electret material formed at the bottom of each recess. The plurality of heterostructures is etched from the epitaxial wafer to form a plurality of heterostructure pills. The plurality of heterostructure pills is slurried over the surface of the dielectric layer so that individual heterostructure pills can fall into a recess and be retained therein due to the strong short-range magnetic or electrical attractive force between the magnetized magnetic layer in the recess and the non-magnetized magnetic layer on the heterostructure pill or between the polarized electret material in the recess and the dielectric on the heterostructure pill. Any excess heterostructure pills that are not retained in a recess formed within the dielectric layer are removed and an overcoat is applied to form a substantial planar surface.

REFERENCES:
patent: 3439416 (1969-04-01), Yando
patent: 5355577 (1994-10-01), Cohn
patent: 5545291 (1996-08-01), Smith et al.
patent: 5783856 (1998-07-01), Smith et al.
patent: 5824186 (1998-10-01), Smith et al.
patent: 5904545 (1999-05-01), Smith et al.
patent: 6300149 (2001-10-01), Smith
patent: 6495019 (2002-12-01), Filas et al.
patent: 6521931 (2003-02-01), Sandhu et al.
patent: 6555889 (2003-04-01), Hiramoto et al.
patent: 6614103 (2003-09-01), Durocher et al.
patent: 6661071 (2003-12-01), Lenssen et al.
patent: 6780696 (2004-08-01), Schatz
patent: 2002/0005294 (2002-01-01), Mayer et al.
patent: 2002/0017667 (2002-02-01), Shimoda et al.
“Electroplated thick permanent magnet arrays with controlled direction of magnetization for MEMS application,” Cho et al.Journal of Applied Physics. May 2000. vol. 87, No. 9.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

System for field assisted statistical assembly of wafers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with System for field assisted statistical assembly of wafers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and System for field assisted statistical assembly of wafers will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2756506

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.