Active solid-state devices (e.g. – transistors – solid-state diode – Specified wide band gap semiconductor material other than...
Reexamination Certificate
2011-08-30
2011-08-30
Pert, Evan (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Specified wide band gap semiconductor material other than...
C257S077000, C257SE21054, C257SE21270, C438S105000, C438S931000
Reexamination Certificate
active
08008668
ABSTRACT:
LED devices and methods for making such devices are provided. One such method may include forming epitaxially a substantially single crystal SiC layer on a substantially single crystal Si wafer, forming epitaxially a substantially single crystal diamond layer on the SiC layer, doping the diamond layer to form a conductive diamond layer, removing the Si wafer to expose the SiC layer opposite to the conductive diamond layer, forming epitaxially a plurality of semiconductor layers on the SiC layer such that at least one of the semiconductive layers contacts the SiC layer, and coupling an n-type electrode to at least one of the semiconductor layers such that the plurality of semiconductor layers is functionally located between the conductive diamond layer and the n-type electrode.
REFERENCES:
patent: 959054 (1910-05-01), Glover
patent: 4012242 (1977-03-01), Matare
patent: 4390379 (1983-06-01), Lien
patent: 4604106 (1986-08-01), Hall
patent: 4751099 (1988-06-01), Nino et al.
patent: 4860615 (1989-05-01), Goldstein et al.
patent: 4912063 (1990-03-01), Davis et al.
patent: 4912064 (1990-03-01), Kong et al.
patent: 4981818 (1991-01-01), Anthony et al.
patent: 5219632 (1993-06-01), Shimakur et al.
patent: 5252173 (1993-10-01), Inoue
patent: 5272355 (1993-12-01), Namavar et al.
patent: 5281299 (1994-01-01), Escoffier et al.
patent: 5362523 (1994-11-01), Gorynin et al.
patent: 5390626 (1995-02-01), Nagasawa et al.
patent: 5455000 (1995-10-01), Seyferth et al.
patent: 5525374 (1996-06-01), Ritland et al.
patent: 5541423 (1996-07-01), Hirabayashi
patent: 5562769 (1996-10-01), Dreifus et al.
patent: 5645471 (1997-07-01), Strecker
patent: 5656821 (1997-08-01), Sakuma
patent: 5662965 (1997-09-01), Deguchi et al.
patent: 5744825 (1998-04-01), Zachai et al.
patent: 5755879 (1998-05-01), Shintani et al.
patent: 5879450 (1999-03-01), Lee et al.
patent: 5895706 (1999-04-01), Yoshinaga
patent: 5919305 (1999-07-01), Solomon
patent: 6054719 (2000-04-01), Fusser et al.
patent: 6117750 (2000-09-01), Bensahel et al.
patent: 6214079 (2001-04-01), Kear et al.
patent: 6303473 (2001-10-01), Heffernan et al.
patent: 6447604 (2002-09-01), Flynn et al.
patent: 6468347 (2002-10-01), Motoki et al.
patent: 6488771 (2002-12-01), Powell et al.
patent: 6537370 (2003-03-01), Hernandez et al.
patent: 6580196 (2003-06-01), Shiono et al.
patent: 6616757 (2003-09-01), Melnik et al.
patent: 6649287 (2003-11-01), Weeks, Jr. et al.
patent: 6736894 (2004-05-01), Kawahara et al.
patent: 6794276 (2004-09-01), Letertre et al.
patent: 6896728 (2005-05-01), Falster et al.
patent: 6936851 (2005-08-01), Wang
patent: 6946788 (2005-09-01), Suehiro et al.
patent: 7012239 (2006-03-01), Kim et al.
patent: 7033912 (2006-04-01), Saxler
patent: 7071490 (2006-07-01), Edmond et al.
patent: 7157741 (2007-01-01), Kim et al.
patent: 7172957 (2007-02-01), Namba et al.
patent: 7183206 (2007-02-01), Shepard
patent: 7618880 (2009-11-01), Quick
patent: 2002/0096104 (2002-07-01), Yagi et al.
patent: 2002/0173234 (2002-11-01), Sung et al.
patent: 2004/0018749 (2004-01-01), Dorfman
patent: 2004/0144990 (2004-07-01), Udagawa
patent: 2005/0074355 (2005-04-01), Pickard et al.
patent: 2008/0113496 (2008-05-01), Keller et al.
patent: 2008/0251812 (2008-10-01), Yoo
patent: 2009/0001383 (2009-01-01), Sung
patent: 2 398 672 (2004-08-01), None
Blanchard et al., “New SOI Devices Transferred Onto Fused Silica by Direct Wafer Bonding”, accessed Mar. 29, 2007, pp. 1-6, France.
Lindner et al., “Plasma Activated Wafer Bonding for Thin Silicon-On-Insulator Substrate Fabrication”, Abstract accessed Mar. 29, 2007, Phoenix, AZ & Scharding, Austria.
T.W. Schroeder et al., Selective Si epitaxial growth technique employing atmic hydrogen and substrate temperature modulation, Applied Physics Letters, Oct. 1, 2001, vol. 79, Issue 14, pp. 2181-2183, Cornell University, Ithaca, New York.
Pert Evan
Thorpe North & Western LLP
Wilson Scott
LandOfFree
Doped diamond LED devices and associated methods does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Doped diamond LED devices and associated methods, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Doped diamond LED devices and associated methods will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2755701