Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2008-04-15
2008-04-15
Lebentritt, Michael (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C257SE23011
Reexamination Certificate
active
07358116
ABSTRACT:
A substrate with at least one conductive post formed prior to the formation of an inter-layer dielectric (ILD) coating on the substrate. The conductive post may be formed from a metal layer of the substrate. Additionally, the conductive post may be built up on the substrate.
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Intel Corporation
Lebentritt Michael
Ortiz Kathy
Stevenson Andre′
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