Characterizing residue on a sample

Optics: measuring and testing – By light interference – For dimensional measurement

Reexamination Certificate

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Reexamination Certificate

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07362448

ABSTRACT:
A residue detection system collects at least one of the spectrum and image from a measurement region on a sample. Spectral analysis is performed on the collected spectrum to determine whether residue is present and if so the thickness of the residue. The spectral analysis uses a calibration metric that correlates a monitoring parameter to the thickness of the residue. The monitoring parameter is at least one of the reflectance value at one or more of the local minima and maxima in the spectrum, the shape of one or more of the local minima and maxima in the spectrum, and the difference in reflectance values between at least two of the local minima and maxima in the spectrum. In one embodiment, imaging analysis is performed on the collected image of the measurement region if no residue is detected by the spectral analysis.

REFERENCES:
patent: 6020968 (2000-02-01), Horie
patent: 6166801 (2000-12-01), Dishon et al.
patent: 6292265 (2001-09-01), Finarov et al.
patent: 6368181 (2002-04-01), Dvir et al.
patent: 6510395 (2003-01-01), Stanke
patent: 6882416 (2005-04-01), Hunter et al.
patent: 2003/0030822 (2003-02-01), Finarov
patent: 2003/0086097 (2003-05-01), Finarov
patent: 2004/0106217 (2004-06-01), Higgs
patent: WO 00/54325 (2000-09-01), None
patent: WO 02/35217 (2002-05-01), None
patent: WO 03/049150 (2003-06-01), None
Brian E. Stine, et al., “Rapid Characterization and Modeling of Pattern-Dependent Variation in Chemical-Mechanical Polishing” IEEE Transactions on Semiconductor Manufacturing, vol. 11, No. 1, pp. 129-140, Feb. 1998.

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