Method for fabricating a printed circuit board having a...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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C029S831000, C029S850000, C174S266000, C361S803000

Reexamination Certificate

active

07404250

ABSTRACT:
A method of fabricating a printed circuit board having a coaxial via, includes. The method includes assembling a plurality of layers configured in a stack so that the plurality of layers has a top signal layer and a bottom signal layer; forming a hollow via through the plurality of layers to connect GND layers in the printed circuit board, forming or inserting into the hollow via a conductor coated with non-conductive material, covering the top layer and bottom layer with dielectric and patterned signal layers, covering the top layer and bottom layer with a masking agent, plating the top layer and bottom layer with a conductive material that connects signal traces within via, and removing the masking agent from the top layer and bottom layer.

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Notification of transmittal of the International Search Report and the Written Opinion of the International Searching Authority, or the Declaration of Corresponding International Patent Application No. PCT/US06/61550 filed Dec. 4, 2006.

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