Semiconductor device having EMI shielding and method therefor

Details Semiconductor device having EMI shielding and method therefor Semiconductor device having EMI shielding and method therefor

2011-03-01

2011-03-01

Pham, Thanh V (Department: 2894)

Active solid-state devices (e.g., transistors, solid-state diode

With shielding

C257S422000, C257S660000

Reexamination Certificate

active

07898066

ABSTRACT:
A semiconductor device has a substrate having a plurality of metal layers. A die is coupled to the substrate. A plurality of metal wires is provided. At least one end of each of the metal wires is electrically coupled to at least one metal layer. A mold compound is used to encapsulate the die, a first surface of the substrate, and the plurality of metal wires. A portion of at least one metal wire remains exposed. A conductive coating is applied to the mold compound and to the portion of the at least one metal wire exposed.

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