Method of manufacturing a wiring substrate

Details Method of manufacturing a wiring substrate Method of manufacturing a wiring substrate

2008-04-01

2008-04-01

Phan, Tim (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S829000, C029S846000, C029S853000, C216S018000, C216S052000, C427S096100, C427S097200, C428S209000

Reexamination Certificate

active

07350297

ABSTRACT:
A first plating foundation layer is formed by printing on a front face of a sheet-shaped insulating substrate. By inserting a punch into the sheet-shaped insulating substrate having the first plating foundation layer, a through hole is formed while leaving a piece having the plating foundation layer in the portion where the punch is inserted. A second plating foundation layer is formed by printing on a rear face of the sheet-shaped insulating substrate. A first and second wiring layers composed of a metal plating layer are formed by performing electroless plating, and at the same time, a metal plating layer connecting between the first and second wiring layers is formed in the through hole using the plating foundation layer on the piece.

REFERENCES:
patent: 4950173 (1990-08-01), Minemura et al.
patent: 5049244 (1991-09-01), Yarita et al.
patent: 5092958 (1992-03-01), Yarita et al.
patent: 6977130 (2005-12-01), Aoki et al.
patent: 2004/0197487 (2004-10-01), Aoki et al.
patent: 02-246193 (1990-10-01), None
patent: 07-263841 (1995-10-01), None
patent: 2004-048030 (2004-02-01), None

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