Method of manufacturing a device, device, non-contact type...

Details Method of manufacturing a device, device, non-contact type... Method of manufacturing a device, device, non-contact type...

2008-05-13

2008-05-13

Kim, Paul D. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S592100, C029S606000, C029S832000, C029S846000, C029S854000, C029S885000, C174S260000, C427S129000, C427S130000

Reexamination Certificate

active

07370410

ABSTRACT:
Wirings2B1are formed by application of heat treatment after an ink jet system is used to discharge a conductive liquid L onto a provisional substrate5having a predetermined repellent property, bonding an insulating layer4B1to the wirings2B1with an adhesive material3B1therebetween, peeling and removing the provisional substrate5, and bonding and fixing the wirings2B1together with the insulating film4B1to a main substrate1by an adhesive material3B1.

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Communication from Japanese Patent Office regarding counterpart application.
“Development of core-less substrate for multi wiring layers”; Maehara, M.; Kato, I.; Akimoto, S.; Okuma, T.; Lino, R.; Tsukamoto, T.; Electronics Packaging Technology Conference, 2002. 4th; Dec. 10-12, 2002; pp. 280-284.

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