Cooling system for contact cooled electronic modules

Details Cooling system for contact cooled electronic modules Cooling system for contact cooled electronic modules

2011-08-16

2011-08-16

Hoffberg, Robert J (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S679470, C361S679520, C361S679530, C361S699000, C361S704000, C361S715000, C361S716000, C361S720000, C361S721000, C361S727000, C165S080200, C165S104330, C165S185000

Reexamination Certificate

active

08000103

ABSTRACT:
Various embodiments disclose a system and method to provide cooling to electronic components, such as electronic modules or the like. The system includes one or more cold plates that are configured to be thermally coupled to one or more of the electronic components. Internally, each of the cold plates has a cooling fluid flowing inside of at least one passageway. The cooling fluid thus removes heat from the electronic components primarily by conductive heat transfer. An input and an output header are attached to opposite ends of the passageway to allow entry and exit of the cooling fluid. The input and output headers are attached to an external system to circulate the cooling fluid.

REFERENCES:
patent: 4733720 (1988-03-01), Havranek et al.
patent: 5457603 (1995-10-01), Leeb
patent: 5740018 (1998-04-01), Rumbut, Jr.
patent: 5818692 (1998-10-01), Denney et al.
patent: 6393853 (2002-05-01), Vukovic et al.
patent: 6853554 (2005-02-01), Bash et al.
patent: 6882533 (2005-04-01), Bash et al.
patent: 7096926 (2006-08-01), Belady et al.
patent: 7167366 (2007-01-01), Cheon
patent: 7212409 (2007-05-01), Belady et al.
patent: 7250674 (2007-07-01), Inoue
patent: 7286355 (2007-10-01), Cheon
patent: 7312987 (2007-12-01), Konshak
patent: 7552758 (2009-06-01), Garner et al.
patent: 2004/0221604 (2004-11-01), Ota et al.
patent: 03070197 (1991-03-01), None
patent: 03070198 (1991-03-01), None
patent: 03159160 (1991-07-01), None
patent: 2002/280782 (2002-09-01), None
patent: 2002280782 (2002-09-01), None
patent: 2338345 (2008-11-01), None
Chu et al., “Three-Dimensional Circuit Package With Water-Cooled Cold PLate and Pairs of Metal Fins Extending Between Facing Rows of Compenents”, IBM Technical Disclosure, Jul. 1986, p. 734.
“International Application Serial No. PCT/US2008/013880, International Search Report mailed Feb. 17, 2009”, 4 pgs.
“International Application Serial No. PCT/US2008/013880, Written Opinion mailed Feb. 17, 2009”, 5 pgs.

Affiliated with

Also associated with

Rating

Cooling system for contact cooled electronic modules does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Cooling system for contact cooled electronic modules, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cooling system for contact cooled electronic modules will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2748779