Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2008-07-29
2008-07-29
Dang, Trung (Department: 2892)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
C438S106000
Reexamination Certificate
active
07405093
ABSTRACT:
Methods of assembly for a semiconductor light emitting device package may include positioning a submount on a mounting substrate with a solder material and a flux therebetween. The semiconductor light emitting device is positioned on a top side of the submount with a solder material and a flux therebetween to provide an assembled stack that has not been reflowed. The assembled stack is reflowed to attach the submount to the mounting substrate and the light emitting device to the submount.
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International Search Report and Written Opinion for PCT/US2005/028007; Date of mailing Jul. 19, 2006.
Cree Inc.
Dang Trung
Myers Bigel & Sibley & Sajovec
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