Socket contact

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Distinct contact secured to panel circuit

Reexamination Certificate

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Reexamination Certificate

active

07909620

ABSTRACT:
A low-profile socket contact is provided that is mountable on a print substrate and has a high contact pressure. The socket contact includes a base portion provided on a print substrate, and a contact connecting portion connecting to the tab-shaped contact provided on a central portion of the base portion. The base portion has an opening in which the tab-shaped contact passes through, and a plurality of lead portions solderable to the print substrate. The contact connecting portion has a pair of first bending fragments, a pair of first inverted arms, a pair of second bending fragments, and a pair of second inverted arms. A contact point in contact with the tab-shaped contact is provided on each front ends of the pair of first inverted arms, and a guiding face in which the tab-shaped contact slides is provided on the pair of second inverted arms.

REFERENCES:
patent: 6814598 (2004-11-01), Hoffmann et al.
patent: 7393216 (2008-07-01), Masaki et al.
patent: 05-049202 (1993-02-01), None
patent: 05-056599 (1993-03-01), None
patent: 05-115148 (1993-05-01), None
patent: 05-328652 (1993-12-01), None
patent: 07-213002 (1995-08-01), None
patent: 09-093857 (1997-04-01), None
patent: 10-191609 (1998-07-01), None
patent: 2001-112211 (2001-04-01), None
patent: 2001-145298 (2001-05-01), None
patent: 2002-034981 (2002-02-01), None
patent: 2002-100440 (2002-04-01), None
patent: 2004-229378 (2004-08-01), None
patent: 2005-317262 (2005-11-01), None
patent: 2008-017635 (2008-01-01), None

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