Registers – Coded record sensors – Particular sensor structure
Reexamination Certificate
2011-01-18
2011-01-18
Frech, Karl D (Department: 2887)
Registers
Coded record sensors
Particular sensor structure
C235S494000, C356S600000
Reexamination Certificate
active
07871002
ABSTRACT:
Intra-field distortion for a projection imaging tool is determined using a self-referenced rectangular grid reticle pattern, that includes at least two arrays of alignment attributes that are complementary to each other, is exposed multiple times onto a substrate with a recording media. A reference reticle pattern is exposed onto the substrate, wherein the reference reticle pattern overlaps the grid alignment attributes thereby creating completed grid alignment attributes. Positional offsets of the completed alignment attributes and completed grid alignment attributes are measured and an intra-field distortion from the offsets is determined.
REFERENCES:
patent: 4757207 (1988-07-01), Chappelow et al.
patent: 4861148 (1989-08-01), Sato et al.
patent: 4929083 (1990-05-01), Brunner
patent: 5056921 (1991-10-01), Chaney
patent: 5124927 (1992-06-01), Hopewell et al.
patent: 5262257 (1993-11-01), Fukuda et al.
patent: 5285236 (1994-02-01), Jain
patent: 5438413 (1995-08-01), Mazor et al.
patent: 5444538 (1995-08-01), Pellegrini
patent: 5477058 (1995-12-01), Sato
patent: 5700602 (1997-12-01), Dao et al.
patent: 5757507 (1998-05-01), Ausschnitt et al.
patent: 5805290 (1998-09-01), Ausschnitt et al.
patent: 5824441 (1998-10-01), Farrow et al.
patent: 5877861 (1999-03-01), Ausschnitt et al.
patent: 5953128 (1999-09-01), Ausschnitt et al.
patent: 6023338 (2000-02-01), Bareket
patent: 6064486 (2000-05-01), Chen et al.
patent: 6079256 (2000-06-01), Bareket
patent: 6130750 (2000-10-01), Ausschnitt et al.
patent: 6137578 (2000-10-01), Ausschnitt
patent: 6142641 (2000-11-01), Cohen et al.
patent: 6143621 (2000-11-01), Tzeng et al.
patent: 6153886 (2000-11-01), Hagiwara et al.
patent: 6163366 (2000-12-01), Okamoto et al.
patent: 6204912 (2001-03-01), Tsuchiya et al.
patent: 6218200 (2001-04-01), Chen et al.
patent: 6269322 (2001-07-01), Templeton et al.
patent: 6417929 (2002-07-01), Ausschnitt et al.
patent: 6573986 (2003-06-01), Smith et al.
patent: 6734971 (2004-05-01), Smith et al.
patent: 7099011 (2006-08-01), McArthur et al.
patent: 7271905 (2007-09-01), Smith et al.
patent: 2005/0240895 (2005-10-01), Smith et al.
Armitage Jr., J.D. and Kirk, J.P., “Analysis of overlay distortion patterns”, SPIE, 921:207-222, (1988).
Biesterbos et al., “A new lens for aubmicron lithography and its consequences for wafer stepper design”, SPIE, 633:34-43, (1986).
Bjorkholm et al., “Reduction imaging at 14 nm using multilayer-coated optics: printing of features smaller than 0.1 μm”, J. Vac. Sci. Technol.B., 8(6):1509-1543, (1990).
Bruning et al., “Optical Lithography—Thirty years and three orders of magnitude”, SPIE, 3051:14-27, (1997).
Cote et al., “Micrascan III-performance of a third generation, catadioptric step and scan lithographic tool”, SPIE, 3051:806-816, (1997).
DeJule, R., “Mix-and Match: A Necessary Choice”, Semiconductor International, 23(2): 66-76, (Feb. 2000).
Dooly, T. and Yang, Y., “Stepper matching for optimum line performance”, SPIE, 3051:426-432, (1997).
Goodwin, F. and Pellegrini, J.C., “Characterizing Overlay Registration of Concentric 5X and 1X Stepper Exposure Fields using Interfield Data”, SPIE, 3050:407-417, (1997).
Goodwin, F., “Expanding capabilities in existing fabs with lithography tool-matching”, Solid State Technology, 97-106, (Jun. 2000).
Handbook of Microlithography, Micromachining, and Microfabrication, Book: vol. 1, “Microlithography”, Rai-Choudhury, P. (Ed.), SPIE Optical Engineering Press, SPIE, Bellingham, Washington, pp. 417-418, (1997).
Hasan et al., “Automated Electrical Measurements of Registration Errors in Step-and-Repeat optical Lithography Systems”, IEEE Transactions on Electron Devices, ED27(12):2304-2312, (1980).
Kenp et al., “A “golden standard” wafer design for optical stepper characterization”, SPIE, 1464:260-266, (1991).
KLA 5105, “Linewidth and Misregistration System”, KLA 5105 Product Specifications, KLA Instruments Corporation, 2 pages, (1995).
KLA 5200, “Value-added Overlay Metrology for Advanced Lithography”, KLA 5200 Product Specification, KLA Instruments Corporation, 2 pages (1996).
Kodama, K. and Matsubara, E., “Measuring system XY-5i”, SPIE, 2439:144-155, (1995).
Leica LMS IPRO, “Fully automated mask and wafer metrology system”, Leica, pamphlet pp. 1-5.
Lin, B.J., “The Attenuated Phase-Shifting Mask”, Solid State Technology, Special Series/Advanced Lithography, 35(1):43-47, (Jan. 1992).
Martin et al., “Measuring Fab Overlay Programs”, SPIE, 3677:64-71(1999).
Mc Fadden, E.A. and Ausschnitt, C.P., “A Computer Aided Engineering Workstation for Registration Control”, SPIE, 1087:255-266, (1989).
Mulkens et al., “ArF Step and Scan Exposure System for 0.15 m Technology Node?”, SPIE, 3679:506-521, (1999).
Müller et al., “Large Area Fine Line Patterning by Scanning Projection Lithoghraphy”, MCM proceedings, pp. 100-104, (1994).
Newnam, B.E. and Viswanathan, V.K., “Development of XUV projection lithograph at 60-80 nm”, SPIE, 1671:419-436, (1992).
Nikon Lithography Tool Brochures (Japanese Nikon).
Pellegrini, J.C., “Comparisons of Six Different Intrafield Control Paradigms in an Advanced Mix-and-Match Environment”, SPIE, 3050:398-406, (1997).
Pellegrini et al., “Super Sparse Overlay Sampling Plans: An Evaluation of Methods and Algorithms for Optimizing Overlay Quality Control and Metrology Tool Throughput”, SPIE, 3677:72-82, (1999).
Preil, M.E. and McCormack, J.F.M., “A New Approach to Correlating Overlay and Yield”, SPIE, 3677:208-216, (1999).
Press et al, Numerical Recipes, “The Art of Scientific Computing”, Cambridge University Press, New York, pp. 52-64 (1990).
Press et al., Numerical Recipes, The Art of Scientific Computing, Cambridge University Press, 509:520, 1990.
Progler et al., “Method to Budget and Optimize Total Device Overlay”, SPIE, 3679:193-207, (1999).
Quaestor Q7, “Fully Automated Optical Metrology System for Advanced IC Production”, Quaestor Q7 Product Specification, BIO -RAD, 2 pages.
Raugh, M.R., “Error estimation for lattice methods of stage self-calibration”, SPIE, 3050:614-625, (1997).
Starikov et al., “Accuracy of overlay measurements: tool and mark asymmetry effects”, Optical Engineering, 31(6):1298-1310, (1992).
Sullivan, N. T., “Semiconductor Pattern Overlay”, SPIE Critical Reviews of Optical Science and Technology, CR52:160-188, (1994).
Takac et al., “Self-calibration in two-dimensions: the experiment”, SPIE, 2725:130-146, (1996).
van den Brink et al., “Direct-referencing automatic two-points reticle-to-wafer alignment using a projection column servo system”, SPIE, 633:60-71, (1986).
van den Brink et al., “Matching Management of Multiple Wafer Steppers Using a Stable Standard and a Matching Simulator”, SPIE, 1087:218-232, (1989).
van den Brink et al., “Matching of Multiple Wafer Steppers for 0.35 m Lithography Using Advanced Optimization Schemes”, SPIE, 1926:188-207, (1993).
van den Brink et al., “Matching Performance for Multiple Wafer Steppers Using an Advanced Metrology Procedure”, SPIE, 921:180-197, (1988).
van den Brink et al., “New 0.54 Aperture i-Line Wafer Stepper With Field by Field Leveling Combined With Global Alignment”, SPIE, 1463:709-724, (1991).
van den Brink et al., “Step-And-Scan and Step-And-Repeat, A Technology Comparison”, SPIE, 2726:734-753, (1996).
van Schoot et al., “0.7 NA DUV Step & Scan System for 150nm Imaging With Improved Overlay”, SPIE, 3679:448-463, (1999).
Yost, A. and Wu, W., “Lens matching and distortion testing in a multi-stepper, sub-micron environment”, SPIE, 1087:233-244, (1989).
Zavecz et al., “Life Be
Hunter, Jr. Robert O.
McArthur Bruce B.
Smith Adlai H.
Frech Karl D
Litel Instruments
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