Semiconductor encapsulating epoxy resin composition and...

Details Semiconductor encapsulating epoxy resin composition and... Semiconductor encapsulating epoxy resin composition and...

2011-08-16

2011-08-16

Eashoo, Mark (Department: 1767)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

C438S127000

Reexamination Certificate

active

07999016

ABSTRACT:
Epoxy resin compositions comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) an inorganic filler, (D) a rare earth oxide, and optionally (E) a phosphazene compound cure into products having improved heat resistance and moisture-proof reliability and are best suited for the encapsulation of semiconductor devices.

REFERENCES:
patent: 5391446 (1995-02-01), Ohtani et al.
patent: 2003/0166757 (2003-09-01), Nishihara et al.
patent: 2004/0006168 (2004-01-01), Wagner et al.
patent: 2004/0013911 (2004-01-01), Maeda
patent: 2006/0241215 (2006-10-01), Osada et al.
patent: 2006/0241250 (2006-10-01), Osada et al.
patent: 6-51826 (1994-07-01), None
patent: 2501820 (1996-03-01), None
patent: 2519277 (1996-05-01), None
patent: 9-118810 (1997-05-01), None
patent: 2712898 (1997-10-01), None
patent: 10-158360 (1998-06-01), None
patent: 10-259292 (1998-09-01), None
patent: 2843244 (1998-10-01), None
patent: 10-292094 (1998-11-01), None
patent: 11-12438 (1999-01-01), None
patent: 11-240937 (1999-09-01), None
patent: 11-310766 (1999-11-01), None
patent: 2000-159520 (2000-06-01), None
patent: 2000-204227 (2000-07-01), None
patent: 2000-230110 (2000-08-01), None
patent: 3167853 (2001-03-01), None
patent: 2002-80566 (2002-03-01), None
patent: 2002-275358 (2002-09-01), None
patent: 2003-138102 (2003-05-01), None
Iwai, H.; Ohmi, S.; Akama, S.; Ohshima, C.; Kashiwagi, I.; Kikuchi, A.; Taguchi, J.; Yamamoto, H.; Ueda, I.; Kuriyama, A.; Tonotani, J.; Kim, Y.; Yoshihara, Y.; Ishiwara, H. “Hight Dielectric Constant Gate Insulator Technology Using Rare Earth Oxides.” Sym. on VLSI Tec. 2000. 2001, IEDM 200, 2001, IWGI 2001 (2001).
Kamisawa et al., “Research on effective use of rare-earth elements,” Special Research Reports of Agency of Industrial Science and Technology Ministry of International Trade and Industry, Japan, 2000, vol. 2000, pp. 380-385.

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