Structure and method for reliability evaluation of FCPBGA...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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Reexamination Certificate

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07982475

ABSTRACT:
There is provided a method for measuring thermal properties of a semiconductor packaging material. The method includes incorporating at least one conducting feature into a substrate that includes the semiconductor packaging material, applying an electric current to the feature, and measuring a change in temperature of a region of the substrate around the feature as a result of the electric current. There is also provided a test vehicle for measuring thermal properties of a semiconductor packaging material.

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