Semiconductor package having an antenna with reduced area...

Details Semiconductor package having an antenna with reduced area... Semiconductor package having an antenna with reduced area...

2011-08-30

2011-08-30

Smith, Bradley K (Department: 2894)

Active solid-state devices (e.g., transistors, solid-state diode

With shielding

C257SE23114

Reexamination Certificate

active

08008754

ABSTRACT:
A semiconductor package includes an electromagnetic shielding member for shielding electromagnetic waves. An antenna is disposed on an upper face of the electromagnetic shielding member and includes an antenna part with a plurality of conductive particles electrically connected with each other and an insulation part disposed on the upper face of the electromagnetic shielding member and insulating the antenna part. Ball lands are disposed on the electromagnetic shielding member and are electrically connected with the antenna part. A Radio Frequency Identification (RFID) chip is electrically connected to the ball lands.

REFERENCES:
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patent: 5721021 (1998-02-01), Tobe et al.
patent: 6853087 (2005-02-01), Neuhaus et al.
patent: 2006/0055531 (2006-03-01), Cook et al.
patent: 2002-359319 (2002-12-01), None
patent: 1020020036039 (2002-05-01), None
patent: 1020030012994 (2003-02-01), None
patent: 1020050083323 (2005-08-01), None
patent: 1020080062909 (2008-07-01), None
patent: 03/010796 (2003-02-01), None

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