Method of manufacturing die for forming honeycomb structure...

Details Method of manufacturing die for forming honeycomb structure... Method of manufacturing die for forming honeycomb structure...

2011-07-19

2011-07-19

Evans, Geoffrey S (Department: 3742)

Electric heating

Metal heating

Cutting or disintegrating

Reexamination Certificate

active

07982158

ABSTRACT:
A method for manufacturing a die to be used for formation of honeycomb structure, the die having a die base having two faces, honeycomb-shaped slits5being formed in one face and back holes communicating with the slits5being formed in the other face in order to introduce a forming material thereinto, at least the slit portions of the die being made of a super had alloy,wherein slits5are formed by grinding or electric discharge machining, then a discharging electrode40having a square-shaped section is disposed near each crossing portion of slits5, and electric discharge machining is conducted from the upper side of slit5toward the depth direction of slit.

REFERENCES:
patent: 4290743 (1981-09-01), Suzuki
patent: 4310742 (1982-01-01), Pfau
patent: 4361745 (1982-11-01), Rupert et al.
patent: 5728286 (1998-03-01), Suzuki et al.
patent: 6193497 (2001-02-01), Suzuki
patent: 2005/0118296 (2005-06-01), Kaneko et al.
patent: 2005/0147707 (2005-07-01), Nate et al.
patent: A 8-169005 (1996-07-01), None
patent: A 9-57538 (1997-03-01), None
patent: B2 3080563 (2000-06-01), None
patent: A 2000-326318 (2000-11-01), None
patent: A 2003-285308 (2003-10-01), None
patent: A 2003-285309 (2003-10-01), None

Affiliated with

Also associated with

Rating

Method of manufacturing die for forming honeycomb structure... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing die for forming honeycomb structure..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing die for forming honeycomb structure... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2738677