Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2011-03-22
2011-03-22
Levi, Dameon E (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S760000, C361S772000, C361S774000, C361S777000, C174S261000, C174S262000, C029S840000, C029S852000
Reexamination Certificate
active
07911805
ABSTRACT:
A method of forming contacts for an interconnection element, includes (a) joining a conductive element to an interconnection element having multiple wiring layers, (b) patterning the conductive element to form conductive pins, and (c) electrically interconnecting the conductive pins with conductive features of the interconnection element. A multiple wiring layer interconnection element having an exposed pin interface, includes an interconnection element having multiple wiring layers separated by at least one dielectric layer, the wiring layers including a plurality of conductive features exposed at a first face of the interconnection element, a plurality of conductive pins protruding in a direction away from the first face, and metal features electrically interconnecting the conductive features with the conductive pins.
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International Search Report issued on Oct. 6, 2008 in connection with corresponding International Appln. No. PCT/US2008/007978.
Lerner David Littenberg Krumholz & Mentlik LLP
Levi Dameon E
Nguyen Hoa C
Tessera Inc.
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