Test socket for testing semiconductor package

Details Test socket for testing semiconductor package Test socket for testing semiconductor package

2011-06-07

2011-06-07

Tang, Minh N (Department: 2858)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S754080, C324S755060

Reexamination Certificate

active

07956631

ABSTRACT:
A test socket, adapted for connecting the semiconductor package and a printed circuit board comprises a base and a plurality of contacts received in the base. The base has a retaining board defining a plurality of first receiving holes and a positioning board defining a plurality of second receiving holes. The contacts has a contacting portion, an elastic portion and a retaining portion, the elastic portion is disposed between the retaining board and the positioning board and protruding rightward, and the contacting portion extends beyond the elastic portion and defines a acute angle with a horizontal line in a right hand before contacting with the semiconductor package to prevent the contacting portion from scratching with the left inner sidewall of the second receiving hole when pushed downward by the semiconductor package and rotating leftward.

REFERENCES:
patent: 5247250 (1993-09-01), Rios
patent: 5829988 (1998-11-01), McMillan et al.
patent: 5952843 (1999-09-01), Vinh
patent: 6575767 (2003-06-01), Satoh et al.

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