Metal fusion bonding – Process – Diffusion type
Reexamination Certificate
2011-03-01
2011-03-01
Ward, Jessica L (Department: 1793)
Metal fusion bonding
Process
Diffusion type
C228S262700, C228S262710
Reexamination Certificate
active
07896222
ABSTRACT:
This invention discloses a method, using pure niobium as a transient liquid reactive braze material, for fabrication of cellular or honeycomb structures, wire space-frames or other sparse builtup structures or discrete articles using Nitinol (near equiatomic titanium-nickel alloy) and related shape-memory and superelastic alloys. Nitinol shape memory alloys (SMAs), acquired in a form such as corrugated sheet, discrete tubes or wires, may be joined together using the newly discovered technique. Pure niobium when brought into contact with Nitinol at elevated temperature, liquefies at temperatures below the melting point and flows readily into capillary spaces between the elements to be joined, thus forming a strong joint. A series of diagrams of the interface at various stages of brazing is illustrated by FIG.10.
REFERENCES:
patent: 3897223 (1975-07-01), Purdy et al.
patent: 4034906 (1977-07-01), Carlson et al.
patent: 4038041 (1977-07-01), Duvall et al.
patent: 4770725 (1988-09-01), Simpson et al.
patent: 4973366 (1990-11-01), Yasuda et al.
patent: 5242759 (1993-09-01), Hall
patent: 5540712 (1996-07-01), Kleshinski et al.
patent: 6071308 (2000-06-01), Ballou et al.
patent: 6106642 (2000-08-01), DiCarlo et al.
patent: 6485507 (2002-11-01), Walak et al.
patent: 7288111 (2007-10-01), Holloway et al.
patent: 7300708 (2007-11-01), Gigliotti et al.
patent: 7442200 (2008-10-01), Mazzocchi et al.
patent: 7491229 (2009-02-01), Eder et al.
patent: 2005/0283190 (2005-12-01), Huitema et al.
patent: 388685 (1990-09-01), None
patent: 2021487 (1991-11-01), None
patent: 04182023 (1992-06-01), None
“Transient Liquid Phase Bonding”, MacDonald et al., 1992, Annu. Rev. Mater. Sci. 22:23-46.
“Transient Liquid Phase (TLP) Diffusion Bonding of a Copper Shape Memory Alloy Using Silver as Interlayer”, de Salazar et al., Scripta Materialia, vol. 37, No. 6, pp. 861-867, 1997.
International Search Report for PCT/US05/35348.
Di et al., “Some Properties of Ni-Ti-Nb-X Quarternary Alloys,”Z. Metallkd. 91:258-260 (2000).
Melton et al., “Wide Hysteresis Shape emory Alloys Based on the Ni-Ti-Nb Systenn,”Proceedings of the MRS International Meeting on Advanced Materials, 9:165-170 (1989).
Prima et al., “Investigation e hods and Properties of Powdered Materials,”Powder Metallurgy and Metal Ceramics, 34(3-4):155-160 (1995).
Siegert et al., “Influence of Nb Content and Processing Conditions on Microstructure and Functional Properties of NiTiNb Shape-Memory Alloys,”Materials Science Forum, 394-395:361-364 (2002).
Yufeng et al., “Effects of Heat Treatment on Tensile Properties and Shape Memory Effects of Ni-Ti-Nb Alloy,”Trans. Nonferrous Met. Soc. China, 7(4):92-96 (Dec. 1997).
Zhang et al., “Effects of Deformation on the Transformation Hysteresis and Shape Memory Effect in a Ni47Ti44Nb9Alloy,”Scripta Metallurgica et Materialia, 24:1807-1812 (1990).
Zhao et al., “Deformation-Induced Martensitic Transformation and Its Reversibility in Ni-Ti-Nb Wide Hysteresis Shape Memory Alloys,”Acta Metallurgica Sinica, 33(1):90-98 (Jan. 1997). Abstract Only.
Zhao et al., “Transformation and Mechanical Behavior of a Ni47Ti44Nb9Shape Memory Alloy,”Proceedings of the MRS International Meeting on Advanced Materials., 9:171-176 (1989).
Grummon David S
Shaw John A.
Board of Trustees of Michigan State University
Gamino Carlos
Marshall & Gerstein & Borun LLP
Regents of the University of Michigan
Ward Jessica L
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