Semiconductor device and method for manufacturing the same

Stock material or miscellaneous articles – All metal or with adjacent metals – Plural layers discontinuously bonded

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

07964288

ABSTRACT:
Disclosed is a method of manufacturing a semiconductor device, which includes exposing a photoresist using an exposing mask provided with a light-shielding pattern having two or more narrow width portions, developing the photoresist to form a plurality of stripe-shaped resist patterns, selectively etching a first conductive film using the resist pattern as a mask, forming an intermediate insulating film on the first conductive film, forming a second conductive film on the intermediate insulating film, and forming, by patterning the first conductive film, the intermediate insulating film, and the second conductive film, a flash memory cell and a structure constructed by forming a lower conductor pattern, a segment of the intermediate insulating film, and a dummy gate electrode in this stacking order.

REFERENCES:
patent: 6667511 (2003-12-01), Fang
patent: 7075140 (2006-07-01), Spadea
patent: 7235476 (2007-06-01), Nakagawa
patent: 7307332 (2007-12-01), Nakagawa
patent: 7391071 (2008-06-01), Park et al.
patent: 7504688 (2009-03-01), Nakagawa
patent: 7642592 (2010-01-01), Koo et al.
patent: 7652324 (2010-01-01), Liu
patent: 7663178 (2010-02-01), Arai et al.
patent: 7663912 (2010-02-01), Jeon
patent: 7838921 (2010-11-01), Willer et al.
patent: 7842994 (2010-11-01), Yin et al.
patent: 2001/0044184 (2001-11-01), Tanaka
patent: 2001/0045590 (2001-11-01), Kobayashi
patent: 2002/0011624 (2002-01-01), Ishige
patent: 2003/0036234 (2003-02-01), Doi
patent: 2003/0085421 (2003-05-01), Takeuchi et al.
patent: 2005/0110071 (2005-05-01), Ema et al.
patent: 2006/0226469 (2006-10-01), Nakagawa
patent: 2007/0200166 (2007-08-01), Nakagawa
patent: 2009/0191700 (2009-07-01), Nakagawa
patent: 01-188857 (1989-07-01), None
patent: 08-148658 (1996-06-01), None
patent: 2000-286350 (2000-10-01), None
patent: 2001-332708 (2001-11-01), None
patent: 2005-129760 (2005-05-01), None
patent: 2005-142362 (2005-06-01), None
patent: 2005-244086 (2005-09-01), None
International Search Report of PCT/JP2005/022917, date of mailing Mar. 20, 2006.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device and method for manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and method for manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and method for manufacturing the same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2735777

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.