Semiconductor device, method of manufacturing thereof,...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Beam leads

Reexamination Certificate

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Details

C257S738000, C257S773000, C257S774000, C257S778000, C257S791000, C257SE23021, C257SE21503, C257SE21511, C257SE23060

Reexamination Certificate

active

07982310

ABSTRACT:
A semiconductor device is provided comprising: a semiconductor element including a plurality of electrodes; first wirings coupled to the electrodes and directed toward a center of the semiconductor element from a portion coupled to the electrodes; second wirings coupled between the first wirings and external terminals, the second wirings being directed to an outer area of the semiconductor element relative to the center; and at least one resin layer formed between the first wirings and the second wirings.

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