Method of manufacturing an electronic component substrate

Details Method of manufacturing an electronic component substrate Method of manufacturing an electronic component substrate

2011-03-08

2011-03-08

Arbes, C. J (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S840000, C445S002000

Reexamination Certificate

active

07900348

ABSTRACT:
A method of manufacturing an electronic component substrate is provided, the method allowing manufacturing yield to be improved. The method of manufacturing an electronic component substrate in which a plurality of electronic components are mounted on a first substrate includes the steps of: aligning and disposing the plurality of electronic components on a second substrate; transferring the electronic components on the second substrate onto the first substrate; detecting an electronic component un-mounted portion on the first substrate; and repairing by selectively re-transferring the electronic component from the second substrate onto the detected un-mounted portion on the first substrate.

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Japanese Office Action issued on Jul. 14, 2009, for corresponding Japanese Patent Application 2007-261585.

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