Package mounted module and package board module

Details Package mounted module and package board module Package mounted module and package board module

2011-04-05

2011-04-05

Warren, Matthew E (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S686000, C257S720000, C257SE23084, C361S767000

Reexamination Certificate

active

07919856

ABSTRACT:
A package board module wherein a semiconductor chip such as an LSI is mounted on the topside surface of a package board, and a package mounted module wherein the package board is mounted on the motherboard of a large-sized computer or the like. A stiffener for supporting the package board and/or a stiffener for supporting the motherboard each has a bimetal structure wherein a first member and a second member having mutually different thermal expansion coefficients are respectively adhered to each other, so as to cause the stiffeners to warp in harmony with the warpage of the package board and the motherboard caused by a temperature change, thereby preventing stress from arising in the solder-bonded portions.

REFERENCES:
patent: 4322156 (1982-03-01), Kohyama
patent: 5528462 (1996-06-01), Pendse
patent: 6285553 (2001-09-01), Suyama et al.
patent: 6541855 (2003-04-01), Uzuka
patent: 6638790 (2003-10-01), Minamio et al.
patent: 6743026 (2004-06-01), Brodsky
patent: 6992899 (2006-01-01), Alger et al.
patent: 7132744 (2006-11-01), Zhao et al.
patent: 02-116197 (1990-04-01), None
patent: 8-222658 (1996-08-01), None
patent: 10-243326 (1998-09-01), None
patent: 11-265967 (1999-09-01), None
patent: 2001-320145 (2001-11-01), None
patent: 2002-263972 (2002-09-01), None
patent: 2003-258153 (2003-09-01), None
patent: 2004-214284 (2004-07-01), None
International Search Report of PCT/JP2005/002274, date of mailing Mar. 22, 2005.
Translation of International Preliminary Report on Patentability mailed Aug. 30, 2007 of International Application No. PCT/JP2005/002274.

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