Heatsink structure for solid-state image sensor

Details Heatsink structure for solid-state image sensor Heatsink structure for solid-state image sensor

2011-06-21

2011-06-21

Landau, Matthew C (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257SE31131, C257SE23103, C361S717000

Reexamination Certificate

active

07964958

ABSTRACT:
A heatsink structure for solid-state image sensors includes a foil-like heatsink sheet made of a high heat conductivity material. The heatsink sheet has a first fixed portion fixed to a solid-state image sensor and a second fixed portion fixed to another member. The heatsink sheet also has a plurality of cutout portions formed along directions from the first fixed portion toward the second fixed portion. Thus, the heatsink structure can cool the solid-state image sensor while reducing any external-force loads applied to the solid-state image sensor with a relatively simple structure.

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Machine translation of JP2001-308569.

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