Thermoformed EMI shield

Electricity: conductors and insulators – Anti-inductive structures – Shielded

Reexamination Certificate

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Details

C174S384000, C174S394000, C361S818000

Reexamination Certificate

active

07928326

ABSTRACT:
Systems and methods for minimizing the transmission and reception of electromagnetic interference (“EMI”) are provided. A member having first and second sides and at least one edge can be formed to correspond to the interior of an enclosure. At least one aperture can penetrate the member from the first side to the second side, forming at least one internal edge. A conductive layer can be disposed on or about the first side, the second side, the at least one edge, and the at least one internal edge of the member, thereby encapsulating the member.

REFERENCES:
patent: 4670347 (1987-06-01), Lasik et al.
patent: 4785136 (1988-11-01), Mollet et al.
patent: 4965408 (1990-10-01), Chapman et al.
patent: 5170009 (1992-12-01), Kadokura
patent: 5259792 (1993-11-01), Beck et al.
patent: 5260128 (1993-11-01), Ishii et al.
patent: 5286318 (1994-02-01), Sims et al.
patent: 5374779 (1994-12-01), Konishi
patent: 5527989 (1996-06-01), Leeb
patent: 5652410 (1997-07-01), Hobbs et al.
patent: 5676812 (1997-10-01), Kadokura
patent: 5696196 (1997-12-01), DiLeo
patent: 5704117 (1998-01-01), Mok et al.
patent: 5774344 (1998-06-01), Casebolt
patent: 6090728 (2000-07-01), Yenni, Jr. et al.
patent: 6294730 (2001-09-01), Holmberg et al.
patent: 6410847 (2002-06-01), Allen et al.
patent: 6768654 (2004-07-01), Arnold et al.
patent: 6849800 (2005-02-01), Mazurkiewicz
patent: 6972366 (2005-12-01), Yen et al.
patent: 7005573 (2006-02-01), Lionetta et al.
patent: 7488901 (2009-02-01), Arnold
patent: 2003/0193794 (2003-10-01), Reis et al.
patent: 2007/0199738 (2007-08-01), Gabower
patent: 2009/0108985 (2009-04-01), Haag et al.

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